Packaging Services | Hyper-scale your qubit chip with VIO™

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Packaging Services

Scale your qubit chips with VIO™

Transform your qubit chiplets into scalable quantum processors with QuantWare’s VIO-powered Packaging Services. VIO dramatically simplifies qubit chip design by eliminating complex 2D routing circuits and crossovers. Paired with VIO’s modular chiplet architecture, this approach enables the fabrication of simple, compact, high-yield qubit chips that we assemble into a fully connected, VIO powered QPU. You focus on building the best qubit chips, VIO Packaging Services scales them into large-scale quantum processors.

Start developing your HDK now to develop VIO-compatible chips that are ready to scale with VIO-1K and VIO-40K. Our experts are available to begin the conversation today.

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VIO-HDK

Every VIO generation starts with setting up an HDK

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Establish the foundation

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Your chip

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VIO-HDK powered processor

Every VIO Packaging project begins with developing a Hardware Development Kit (HDK) to validate compatibility at small scale before moving to larger architectures. Establishing the HDK early ensures your chiplets, interfaces, and control workflows are fully aligned with VIO standards. You can begin this phase today, so when VIO-1K and VIO-40K become available, you can transition immediately to large-scale integration.

Shipping 2027

Up to 1K lines

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Your chiplets

Gold-colored high-tech chip labeled VIO 1K with a flexible ribbon cable attached.

VIO-1K powered processor

After completing the initial VIO development phase, VIO-1K enables a major leap in integration with support for up to 1,000 lines. It provides the routing freedom needed to move from small-scale validation to meaningful multi-chiplet architectures, unlocking advanced high-performance systems.

Shipping 2028

Up to 40K lines

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Your chiplets

Gold and copper-colored quantum computer processor module labeled VIO 40K.

VIO-40K powered processor

Building on the foundation established in the earlier development stages, VIO-40K delivers up to 40,000 lines for unprecedented QPU scale. It enables to turn your chips into the first utility-class quantum processors.

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Frequently asked questions

What level of customization is available in terms of chip topology for your Packaging Services?

Our Packaging Services support full customizability without restriction. We package any chip required for your proprietary algorithms or QEC research.

Will a custom QPU fabricated through your Packaging Services still adhere to the 'Quantum Open Architecture' for system integration?

Absolutely. All QPUs created via our Packaging Services are built on the Quantum Open Architecture model, guaranteeing seamless integration into any quantum stack. They are fully compatible with industry-standard control systems like QuantrolOx’s Quantum EDGE and Q-CTRL’s Boulder Opal.

What factors determine the final cost of a project using your Packaging Services?

The price is project-specific, based on complexity and the quantity of QPUs ordered. Please contact us to explore your project and receive a precise, detailed quotation.

What degree of technical support is provided throughout the fabrication and initial testing process?

We act as a technical partner, providing expert support and documentation. Your dedicated Customer Success Engineer and Application Scientist ensure the final QPUs are ready for installation and optimal use.

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Build bigger, scale faster

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Peripherals

Build your readout chain with our peripheral components

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Foundry Services

Hyper-scale your qubit design with VIO™

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